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K tomu liquid metal coolingu by som dodal celkom pekny post na reddite, ktory vysvetluje ako Sony vyriesilo ten problem, ze ho treba po case menit (tl;dr maju patent, ktory by mal zarucit ze v PS5 ho menit nebude treba):
"Sony tackled the issue by sealing the die and the compound hermetically under the radiator. We've seen this on their patent, but couldn't interpret it earlier.
You can see on the pic that there's a seal around SOC chip with a tiny gap around.
Gap is for the thermal expansion of LM. If it was sealed flat, there would be constant pressure build-ups during heating up which might have lead to die degradation.
It's clearly visible on the patent, that this tiny gap creates a compartment around the SOC, and all conductive elements are sealed under and around it."